關於我們
論著附錄
一、國際期刊論文
1. Kuo-Yu Lee, Jun-Tang Huang, Pen-Shan Chao, Jian Min Lin, Hou-Jun Hsu, “An integrated electroless nickel plating process for fabrication CMOS-MEMS probe chip” Microelectronic Engineering, Journal of Microelectronic Engineering, 113, pp. 147-151, 2014. (SCI)
2. Jung-Tang Huang, Kuo-Yu Lee, Hou-Jun Hsu, Pen-Shan Chao and Chung-Yi Lin, “MEMS High-Density Probe Cards”, Engineering Encyclopedia of Nanotechnology, pp.1327-1335, 2012. (SCI)
3. Pen-Shan Chao, Jun-Tang Huang, Hou-Jun Hsu, Sheng-Hsiung Shin, “Fabrication on Uniform Plating-Based Flip Chip Solder Bumps after Reflow Process Using a Polishing Mechanism” Microelectronic Engineering, Journal of Microelectronic Engineering, Vol. 84, Issue 1, pp. 60-71, 2007. (SCI) (2007 Impact Factor: 1.503*)
4. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “A Novel Bumping Process for Fine Pitch Sn-Cu Lead-Free Plating-Based Flip Chip Solder Bumps”, Journal of Materials Science in Semiconductor Processing, Vol. 10, Issue 4-5, pp. 133-142, August-October, 2007. (SCI) (2007 Impact Factor: 0.655*)
5. Hou-Jun Hsu, Jun-Tang Huang, Pen-Shan Chao, Sheng-Hsiung Shin, “Surface Modification onPlating-Based Cu/Sn-0.7Cu Lead-Free Copper Pillars by Using Polishing”, Journal of Microelectronic Engineering, Vol. 85, Issue 7, pp. 1595-1601, July, 2008. (SCI) (2007 Impact Factor: 1.503*)
二、國際研討會論文
1. Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, Kuo-Yu Lee, Chan-Shoue Wu, Sheng-Hsiung Shih, Ming-Zhe Lin, Feng-Yue Lee, Zheng-Chang Lan, “Fabrication of a MEMS-Based Cobra Probe”, IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC 2007), Taiwan, pp. 809-812, 2007.
2. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Batch-mode Fabrication on Easy Medicated Drug-eluting Stents by MEMS Process”, 4th International Conference on Materials for Advanced Technologies (ICMAT), Singapore, pp. 88-91, 2007.
3. Jun-Tang Huang, Chan-Shoue Wu, Kou-Yu Lee, Hou-Jun Hsu, Pen-Shan Chao, Sheng-Hsiung Shin, “Batch Mode Fabrication on High Coplanarity with Pressure Sensors by Using MEMS”, 4th International Conference on Materials for Advanced Technologies (ICMAT), Singapore, pp. 84-87, 2007.
4. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Fine Pitch Electroplated Copper Posts with Ultra-high Coplanarity by Using A Micro-polishing Process”, 4th International Conference on Materials for Advanced Technologies (ICMAT), Singapore, pp.92-95, 2007.
5. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Using an Innovative Polishing Process to Fabricate Ultra-high Uniformity of Polymer Surface”, IEEE 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Tokyo, pp. 213-216, 2007.
6. Jung-Tang Huang, Ming-Chieh Chiu, Kuo-Yu Lee, Chan-Shoue Wu, Hou-Jun Hsu, Pen-Shan Chao, “Development of CMOS Process Compatible Force Sensor and its Application to Probe Card”, IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC 2007), Taiwan, pp. 817-820, 2007.
7. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Batch-mode Fabrication on Stent by Using MEMS Process”, 3rd WACBE World Congress on Bioengineering, Thailand, 2007.
8. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Fabrication on Variety of Uniform Plating-based MEMS Structures Using a Novel Polishing Process”, IMAPS-Taiwan International Symposium, pp.6-11, 2006.
9. Pen-Shan Chao, Jun-Tang Huang, Hou-Jun Hsu, Sheng-Hsiung Shin, “Fabrication on Extra-High Uniformity of Multiple Plating-Based Copper Pillar”, IEEE 8th VLSI Packaging Workshop, Japan, pp. 21-24, 2006.Hou-Jun Hsu, Jun-Tang Huang, Pen-Shan Chao, Sheng-Hsiung Shin, “Singular Uniformity after Reflow of Varied-Shaped Flip Chip Solder Bump on Single Substrate ”, IEEE EMAP 8th International Conference on Electronic Materials and Packaging, Hong Kong, pp. 234-239, 2006.
10. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Combination of Fine Pitch and High Uniformity of Lead-Free Plating-Based Flip Chip Solder Bumps”, IEEE EMAP 8th International Conference on Electronic Materials and Packaging, Hong Kong, pp. 261-266, 2006.
11. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “A Novel Polishing Mechanism Used in Manufacturing Ultra-High Uniformity Gold Solder Bump”, IEEE Electronics Packaging Technology Conference, Singapore, pp.705-710, 2005.
12. Pen-Shan Chao, Jun-Tang Huang, Hou-Jun Hsu, Sheng-Hsiung Shin, “ High Uniformity Solder Bump Fabrication by Using Polishing Process ”, IMAPS-Taiwan International Symposium, pp.161-166, 2005.
13. Jun-Tang Huang, Chung-Yi Lin, Wen-Shiung Lai, Pen-Shan Chao, Sheng-Hsiung Shin, “High Density Vertical Probe Card Fabrication with Low Cost and High Precision Characteristics by Using MEME Process”, IEEE Electronics Packaging Technology Conference, Singapore, pp.107-112, 2005.
14. Jung-Tang Huang, Pen-Shan Chao, “Method and Device for Control the Height of Bump Fabricated in Wafer-Level Flip-Chip Packaging”, IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Aug, 11-14, 2002.
三、國內研討會論文
1. Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, Sheng-Hsiung Shih, “Batch-type Stent Fabrication ”, 9th Nano and Micro-sytem Technology Conference, Taiwan, 2005.
四、國軍刊物投稿與其他研究報告
1. 趙本善，中科院逸光電子報，“無拘無「塑」的健康新生活。從替換美耐皿餐具做起”，741期，106年。
2. 趙本善，陸軍通資半年期刊，“未來軍用物聯網發展與應用介紹”，105年。
3. 趙本善，陸軍聯合後勤季刊，“第三次世界工業革命核心技術—3D列印技術”，105年。
4. 趙本善，陸軍通資半年期刊，“無線射頻識別(RFID)技術於國防科技最新發展趨勢介紹”，105年。
5. 趙本善，中科院逸光電子報，“協助本所推動民間企業申請政府補助計畫經驗分享(上)”，687期，104年。
6. 趙本善，中科院逸光電子報，“協助本所推動民間企業申請政府補助計畫經驗分享(下)”，688期，104年。
7. 趙本善，李郭昱，中科院新新季刊，“可攜式微能源於國防應用之展望”，第42卷第1期，第76-85頁，103年。
8. 趙本善，李郭昱，中科院新新季刊，“電鑄微結構製作技術”，第42卷第2期，第214-216頁，103年。
9. 趙本善，陸軍通資半年期刊，“高(寬)頻非平面螺旋天線介紹”，103年。
10. 趙本善，陸軍通資半年期刊，“新世代電子構裝革新技術─3D 電子構裝”， 第42卷第3期，第158-168頁，103年。
11. 趙本善，陸軍聯合後勤季刊，“具自我修復功能之智慧材料介紹”，103年第4期，第98-108頁。
12. 趙本善，中科院新新季刊，“淺談高值化美國專利申請實務”， 第42卷第3期，第119-128頁，103年。
13. 趙本善，中科院逸光電子報，“本院轉型後應具有之智財新思維─創造質量並重的高值化美國專利”，680期，103年。
14. 趙本善，中科院逸光電子報，“創造另類台灣之光─環保運動機能服飾最佳化設計”，682期，103年11月16日。
15. 趙本善，核生化防護半年刊，“可攜式無線奈米生化氣體感測器研究與發展介紹”，第96期，第47-64頁，102年。
16. 趙本善，中山科學研究院新新季刊，“鎳鈀合金於抗沾黏鍍膜應用”，第41卷第1期，第213-215頁，102年。
17. 趙本善，陸軍通資半年期刊，“高科技軍事電子元件與系統微型化介紹”，101年。
18. 趙本善，台灣經濟綜合研究院， “新世代電動車充電系統與設施發展趨勢介紹”，101年。
五、國內外專利領證
1. 胡紹俊、趙本善、曾世昌、陳堃峰、劉維欽、洪國洋、楊令樂，“MICROELECTRONIC 3D PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME"，美國發明專利，證書號:US92889072 B2。
2. 姜智豪、趙本善、張家華、王智、李浚瑀，“非平面天線嵌入式封裝結構及其製作方法”，中華民國發明專利，證書號: I557983。
3. 杜正恭、趙本善、王宜代，“插件器抗沾黏鍍膜結構”，中華民國發明專利，證書號: I387753。
4. 趙本善，“具修補層之測試載板”，中華民國發明專利，證書號: I380026。
5. 趙本善，“具有修補層金屬墊之測試載板製造方法”，中華民國發明專利，證書號: I387759。
6. 趙本善，“測試插座之製作方法及其所使用的彈性測試探針”，中華民國發明專利，證書號: I387753。
7. 趙本善， “彈性測試探針及其製作方法” ，中華民國發明專利，證書號: I367340。
8. 黃榮堂、趙本善、許后竣，“管狀支架的批量製造方法”中華民國發明專利，證書號: I280942。
9. 黃榮堂、趙本善、許后竣、吳昌修、李郭昱，“CMOS製程相容的微機電探針卡”，中華民國發明專利，證書號: I345064。
10. 黃榮堂、趙本善、許后竣， “METHOD OF FABRICATION ON HIGH COPLANARITY OF COPPER PILLAR FOR FLIP CHIP PACKAGING APPLICATION”, JP2007214571 (A), 2007/08，日本發明專利，證書號: JP473027B2。
1. Kuo-Yu Lee, Jun-Tang Huang, Pen-Shan Chao, Jian Min Lin, Hou-Jun Hsu, “An integrated electroless nickel plating process for fabrication CMOS-MEMS probe chip” Microelectronic Engineering, Journal of Microelectronic Engineering, 113, pp. 147-151, 2014. (SCI)
2. Jung-Tang Huang, Kuo-Yu Lee, Hou-Jun Hsu, Pen-Shan Chao and Chung-Yi Lin, “MEMS High-Density Probe Cards”, Engineering Encyclopedia of Nanotechnology, pp.1327-1335, 2012. (SCI)
3. Pen-Shan Chao, Jun-Tang Huang, Hou-Jun Hsu, Sheng-Hsiung Shin, “Fabrication on Uniform Plating-Based Flip Chip Solder Bumps after Reflow Process Using a Polishing Mechanism” Microelectronic Engineering, Journal of Microelectronic Engineering, Vol. 84, Issue 1, pp. 60-71, 2007. (SCI) (2007 Impact Factor: 1.503*)
4. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “A Novel Bumping Process for Fine Pitch Sn-Cu Lead-Free Plating-Based Flip Chip Solder Bumps”, Journal of Materials Science in Semiconductor Processing, Vol. 10, Issue 4-5, pp. 133-142, August-October, 2007. (SCI) (2007 Impact Factor: 0.655*)
5. Hou-Jun Hsu, Jun-Tang Huang, Pen-Shan Chao, Sheng-Hsiung Shin, “Surface Modification onPlating-Based Cu/Sn-0.7Cu Lead-Free Copper Pillars by Using Polishing”, Journal of Microelectronic Engineering, Vol. 85, Issue 7, pp. 1595-1601, July, 2008. (SCI) (2007 Impact Factor: 1.503*)
二、國際研討會論文
1. Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, Kuo-Yu Lee, Chan-Shoue Wu, Sheng-Hsiung Shih, Ming-Zhe Lin, Feng-Yue Lee, Zheng-Chang Lan, “Fabrication of a MEMS-Based Cobra Probe”, IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC 2007), Taiwan, pp. 809-812, 2007.
2. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Batch-mode Fabrication on Easy Medicated Drug-eluting Stents by MEMS Process”, 4th International Conference on Materials for Advanced Technologies (ICMAT), Singapore, pp. 88-91, 2007.
3. Jun-Tang Huang, Chan-Shoue Wu, Kou-Yu Lee, Hou-Jun Hsu, Pen-Shan Chao, Sheng-Hsiung Shin, “Batch Mode Fabrication on High Coplanarity with Pressure Sensors by Using MEMS”, 4th International Conference on Materials for Advanced Technologies (ICMAT), Singapore, pp. 84-87, 2007.
4. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Fine Pitch Electroplated Copper Posts with Ultra-high Coplanarity by Using A Micro-polishing Process”, 4th International Conference on Materials for Advanced Technologies (ICMAT), Singapore, pp.92-95, 2007.
5. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Using an Innovative Polishing Process to Fabricate Ultra-high Uniformity of Polymer Surface”, IEEE 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Tokyo, pp. 213-216, 2007.
6. Jung-Tang Huang, Ming-Chieh Chiu, Kuo-Yu Lee, Chan-Shoue Wu, Hou-Jun Hsu, Pen-Shan Chao, “Development of CMOS Process Compatible Force Sensor and its Application to Probe Card”, IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC 2007), Taiwan, pp. 817-820, 2007.
7. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Batch-mode Fabrication on Stent by Using MEMS Process”, 3rd WACBE World Congress on Bioengineering, Thailand, 2007.
8. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Fabrication on Variety of Uniform Plating-based MEMS Structures Using a Novel Polishing Process”, IMAPS-Taiwan International Symposium, pp.6-11, 2006.
9. Pen-Shan Chao, Jun-Tang Huang, Hou-Jun Hsu, Sheng-Hsiung Shin, “Fabrication on Extra-High Uniformity of Multiple Plating-Based Copper Pillar”, IEEE 8th VLSI Packaging Workshop, Japan, pp. 21-24, 2006.Hou-Jun Hsu, Jun-Tang Huang, Pen-Shan Chao, Sheng-Hsiung Shin, “Singular Uniformity after Reflow of Varied-Shaped Flip Chip Solder Bump on Single Substrate ”, IEEE EMAP 8th International Conference on Electronic Materials and Packaging, Hong Kong, pp. 234-239, 2006.
10. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “Combination of Fine Pitch and High Uniformity of Lead-Free Plating-Based Flip Chip Solder Bumps”, IEEE EMAP 8th International Conference on Electronic Materials and Packaging, Hong Kong, pp. 261-266, 2006.
11. Jun-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu, Sheng-Hsiung Shin, “A Novel Polishing Mechanism Used in Manufacturing Ultra-High Uniformity Gold Solder Bump”, IEEE Electronics Packaging Technology Conference, Singapore, pp.705-710, 2005.
12. Pen-Shan Chao, Jun-Tang Huang, Hou-Jun Hsu, Sheng-Hsiung Shin, “ High Uniformity Solder Bump Fabrication by Using Polishing Process ”, IMAPS-Taiwan International Symposium, pp.161-166, 2005.
13. Jun-Tang Huang, Chung-Yi Lin, Wen-Shiung Lai, Pen-Shan Chao, Sheng-Hsiung Shin, “High Density Vertical Probe Card Fabrication with Low Cost and High Precision Characteristics by Using MEME Process”, IEEE Electronics Packaging Technology Conference, Singapore, pp.107-112, 2005.
14. Jung-Tang Huang, Pen-Shan Chao, “Method and Device for Control the Height of Bump Fabricated in Wafer-Level Flip-Chip Packaging”, IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Aug, 11-14, 2002.
三、國內研討會論文
1. Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, Sheng-Hsiung Shih, “Batch-type Stent Fabrication ”, 9th Nano and Micro-sytem Technology Conference, Taiwan, 2005.
四、國軍刊物投稿與其他研究報告
1. 趙本善，中科院逸光電子報，“無拘無「塑」的健康新生活。從替換美耐皿餐具做起”，741期，106年。
2. 趙本善，陸軍通資半年期刊，“未來軍用物聯網發展與應用介紹”，105年。
3. 趙本善，陸軍聯合後勤季刊，“第三次世界工業革命核心技術—3D列印技術”，105年。
4. 趙本善，陸軍通資半年期刊，“無線射頻識別(RFID)技術於國防科技最新發展趨勢介紹”，105年。
5. 趙本善，中科院逸光電子報，“協助本所推動民間企業申請政府補助計畫經驗分享(上)”，687期，104年。
6. 趙本善，中科院逸光電子報，“協助本所推動民間企業申請政府補助計畫經驗分享(下)”，688期，104年。
7. 趙本善，李郭昱，中科院新新季刊，“可攜式微能源於國防應用之展望”，第42卷第1期，第76-85頁，103年。
8. 趙本善，李郭昱，中科院新新季刊，“電鑄微結構製作技術”，第42卷第2期，第214-216頁，103年。
9. 趙本善，陸軍通資半年期刊，“高(寬)頻非平面螺旋天線介紹”，103年。
10. 趙本善，陸軍通資半年期刊，“新世代電子構裝革新技術─3D 電子構裝”， 第42卷第3期，第158-168頁，103年。
11. 趙本善，陸軍聯合後勤季刊，“具自我修復功能之智慧材料介紹”，103年第4期，第98-108頁。
12. 趙本善，中科院新新季刊，“淺談高值化美國專利申請實務”， 第42卷第3期，第119-128頁，103年。
13. 趙本善，中科院逸光電子報，“本院轉型後應具有之智財新思維─創造質量並重的高值化美國專利”，680期，103年。
14. 趙本善，中科院逸光電子報，“創造另類台灣之光─環保運動機能服飾最佳化設計”，682期，103年11月16日。
15. 趙本善，核生化防護半年刊，“可攜式無線奈米生化氣體感測器研究與發展介紹”，第96期，第47-64頁，102年。
16. 趙本善，中山科學研究院新新季刊，“鎳鈀合金於抗沾黏鍍膜應用”，第41卷第1期，第213-215頁，102年。
17. 趙本善，陸軍通資半年期刊，“高科技軍事電子元件與系統微型化介紹”，101年。
18. 趙本善，台灣經濟綜合研究院， “新世代電動車充電系統與設施發展趨勢介紹”，101年。
五、國內外專利領證
1. 胡紹俊、趙本善、曾世昌、陳堃峰、劉維欽、洪國洋、楊令樂，“MICROELECTRONIC 3D PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME"，美國發明專利，證書號:US92889072 B2。
2. 姜智豪、趙本善、張家華、王智、李浚瑀，“非平面天線嵌入式封裝結構及其製作方法”，中華民國發明專利，證書號: I557983。
3. 杜正恭、趙本善、王宜代，“插件器抗沾黏鍍膜結構”，中華民國發明專利，證書號: I387753。
4. 趙本善，“具修補層之測試載板”，中華民國發明專利，證書號: I380026。
5. 趙本善，“具有修補層金屬墊之測試載板製造方法”，中華民國發明專利，證書號: I387759。
6. 趙本善，“測試插座之製作方法及其所使用的彈性測試探針”，中華民國發明專利，證書號: I387753。
7. 趙本善， “彈性測試探針及其製作方法” ，中華民國發明專利，證書號: I367340。
8. 黃榮堂、趙本善、許后竣，“管狀支架的批量製造方法”中華民國發明專利，證書號: I280942。
9. 黃榮堂、趙本善、許后竣、吳昌修、李郭昱，“CMOS製程相容的微機電探針卡”，中華民國發明專利，證書號: I345064。
10. 黃榮堂、趙本善、許后竣， “METHOD OF FABRICATION ON HIGH COPLANARITY OF COPPER PILLAR FOR FLIP CHIP PACKAGING APPLICATION”, JP2007214571 (A), 2007/08，日本發明專利，證書號: JP473027B2。